Originally published as Soldering and Surface Mount Technology, Volume 18, Issue 2
ISBN: 1 84663 011 8
Guest Edited by: Chris Bailey and Johan Liu
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP’05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging.
Contents:
Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint
To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry.
High strain rate testing of solder interconnections
This paper aims to present a new micro-impact tester developed for characterizing the impact properties of solder joints and micro-structures at high-strain rates, for the microelectronic industry, and the results evaluated for different solder ball materials, pad finishes and thermal histories by using this new tester. Knowledge of impact force is essential for quantifying the strength of the interconnection and allows quantitative design against failure. It also allows one-to-one comparison with the failure force measured in a standard quasi-static shear test.
Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging
In the flip-chip technology (FCT) used in current microelectronic packages, a Ni-based under-bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In this study, solders joints of eutectic Pb-Sn with a Ni UBM were employed to investigate the intermetallic compound (IMC) formation after aging at 150°C for various periods of time.
Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly
This paper discusses the use of modelling techniques to predict the reliability of an anisotropic conductive film (ACF) flip chip in a humid environment. The purpose of this modelling work is to understand the role that moisture plays in the failure of ACF flip chips.
High performance anisotropic conductive adhesives for lead-free interconnects
To study the interface properties of anisotropic conductive adhesives (ACAs) and improve the electrical properties of ACA joints as a replacement for Sn/Pb solder in the electronics industry.
Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy-based binder that are caused by differences in the curing conditions.
Finite element analysis of fleXBGA reliability
To provide an approach to fleXBGA design and reliability analysis.
About Soldering and Surface Mount Technology
Soldering & Surface Mount Technology is a unique, authoritative, international and multi-disciplinary periodical for those with a research and application interest in all branches of soldering and surface mount technologies. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. All submissions are subject to double-blind peer review.
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